IEEE Transactions on Industry Applications
Transactions on Industry Applications is the flagship publication of the Industry Applications Society. The Editor-In-Chief of Transactions on Industry Applications is Thomas A. Nondahl, email@example.com
Aims and Scope
The scope of the IEEE Transactions on Industry Applications includes all scope items of the IEEE Industry Applications Society, that is, the advancement of the theory and practice of electrical and electronic engineering in the development, design, manufacture, and application of electrical systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; industry leadership in energy conservation and environmental, health, and safety issues; the creation of voluntary engineering standards and recommended practices; and the professional development of its membership.
Up to date statistics for Transactions on Industry Applications are published on its IEEE Xplore page, along with information about recently published papers.
For its flagship Transaction and Magazine, IAS maintains a Present-to-Publish policy. The fundamental principle behind this policy is that face-face explanation and defense of a piece of work provides valuable feedback to authors about any limitations and opportunities to improve the work. Based on the in-person feedback gained presenting work at a conference, authors can then further improve their papers prior to publication in Transactions on Industry Applications or Industry Applications Magazine. This policy means that authors cannot directly submit papers to Transactions on Industry Applications. Authors must be invited to submit their work for review by a Technical Committee after presentation at a conference. If the paper is of a suitable quality, The Technical Committee Paper Review Chair then makes a recommendation for publication in either Transactions or the Magazine. The procedures for this process depend on the relevant Technical Department and Technical Committee, more information is available in the Information for Authors section.